IC Package Design Engineer

Role: IC Package Design Engineer

Location: Malaysia - Penang 8

Working Model: Work From Home (Remote)

Experience: 3+ Years in IC Packaging & PCB Design

Notice Period: Immediate to 45 days

Description:

As an IC Package Design Engineer, you will be responsible for executing high-density package layout designs across Intel's product portfolios (Test Chips, CPUs, Chipsets, SoC designs, Test Vehicles, and more)

Responsibilities:

- IC package layout design including feasibility studies, substrate layout design/routing, DRC, package stack up, ball map, etc.

- Using the Mentor Graphics Expedition PCB software to design the substrate in compliance with existing design rules, electrical requirements, and processes.

- Respond to customer and/or client requirements or events as they occur.

- Generating high-quality design documents promptly for manufacturers and package assembly modules.

Requirements:

Bachelor's degree or with 3+ years of work experience in the related fields.

- Experienced in using Package/Board CAD layout design and software tools such as Mentor Graphics Expedition PCB.

- Must understand various interface requirements like DDR/PCIe/SERDES etc.

- Good technical knowledge of electrical field theories and electronic fundamentals. Those with sound knowledge of electromagnetic and microwave theory are encouraged to apply.

Thanks & Regards,

Richard Martin J,

[Confidential Information]