Physical Design Engineer

Responsibilities include (but not limited to):

You will be participating in the leading-edge System-On-a-Chip (SoC) design projects using cutting-edge process technology nodes for various client applications.

Ideate, develop, and execute physical design solutions.

Participate in design/architecture reviews.

Evaluate and deploy the evolving physical design methodologies to handle increasingly complex SoC/IP designs within aggressive, market-driven schedules.

Active participation in benchmarking of library, technology parameters, and implementation strategy to enable design requirements of die size, power & speed.

Enable technological innovations from day-to-day learning and project experiences.

Actively work as part of a team both locally and also with remote or multi-site teams.

Macroblock and chip level floor planning of digital logic, memories, IOs.

Full chip timing constraints development, full chip Static Timing Analysis, and Signoff for a complex, multi-clock, multi-voltage SoC.

Analyze and incorporate advance timing signoff flows (SSTA, LOCV Based STA, IR Drop aware STA) into SoC timing signoff flow.

Active participation to enhance the flow from the front end (pre-layout) to the back end (post-layout) at both chip level and block level.

Minimum Qualifications:

Minimum of a Bachelor's degree in Electrical and/or Electronics Engineering, Computer Engineering, or any related discipline.

Good level of understanding and hands-on experience in Very Large Scale Integration (VLSI) design and physical design implementation.

Prior experience in timing closure, clock/power distribution and analysis, RC extraction, and correlation.

Hands-on experience in full-chip/sub-chip Static Timing Analysis, timing constraints generation and management, and timing convergence.

Expertise in physical design and optimization: floorplan, placement, routing, cell sizing, buffering, logic restructuring to improve timing and power.

Expertise in analyzing and converging crosstalk delay, noise glitch, and electrical/manufacturing rules in deep-sub-micron processes

Understanding of process variation effect modeling and experience in design convergence taking into account variations.

Experience in critical path planning and crafting.